Includes two HCNR200000E devices Package and form factor - DIP8 package designed for straightforward integration into standard PCB layouts and with DIP sockets - Suitable for through-hole mounting and easy replacement on development or production boards What this component delivers - Used in electronic circuits for specific functions, with the HCNR200000E model offering defined electrical characteristics for reliable and predictable operation - Clear electrical characteristics help ensure consistent performance across typical operating conditions - Compact DIP8 form factor enables efficient use of board space while remaining easy to handle during assembly Key benefits - Easy integration: DIP8 footprint aligns with common PCB designs and socket options - Reliable performance: electrical characteristics provide repeatable behavior in circuits - Efficient stocking: two pieces per purchase supports multiple boards or quick replacements - Versatile fit: suitable for a range of circuit applications that require a DIP8 packaged component 2-3 practical use scenarios - Prototyping and development: use on development boards or in breadboard setups with DIP8 compatibility to evaluate circuit behavior quickly - Production PCB integration: drop-in for assemblies using DIP8 components, enabling straightforward soldering or socket mounting - Education and labs: ideal for teaching circuit design and component characteristics in hands-on lessons using DIP8 components Compatibility and suitability - Works with standard DIP8 footprints and sockets - Fits typical through-hole PCB design workflows and common assembly processes - Maintains consistent electrical performance as specified by the HCNR200000E model Notes - This description reflects the HCNR200000E model with two pieces in DIP8 packaging and its stated role in electronic circuits with defined electrical characteristics.