Feature: 1. Made of high quality stainless steel and the thickness of the steel mesh is very good. 2. Can be heated by a hot air blower directly for better performance and high reliability. 3. These templates are not easily deformed when heated, and can be reballing by hot air blower for convenience. 4. The table mold area matches to the area of the for BGA chip, which can reduce the waste of solder balls. 5. For BGA heavy ball general mold direct heating rework general chip repair of desktop laptop, game consoles, etc. Specification: Condition: 100% Brand New Item Type: For BGA Universal Stencils Material: Stainless Steel Color: As Pictures ShownQuantity: 27Pcs/Set Application: For BGA Chips Reballing Stencils Size: 0.65mm Spacing 1.0mm 0.5mm Spacing 0.8mm 0.45mm Spacing 0.78mm 0.4mm Spacing 0.78mm 0.6mm Spacing 1.0mm 0.6mm Spacing 0.9mm 0.6mm Spacing 1.1mm 0.76mm Spacing 1.27mm 0.55mm Spacing 1.02mm 0.5mm 35 x 35 Spacing 0.78 mm 0.5mm 40 x 40 Spacing 0.8mm 0.76mm 30 x 30 0.6mm 24 x 24 0.6mm 27 x 27 0.3mm Spacing 0.58mm 0.35mm Spacing 0.65mm 0.35mm Spacing 0.6mm 0.3mm Spacing 0.5mm 0.25mm Spacing 0.5mm 0.76mm 34 x 34 0.76mm 37 x 37 Spacing 1.27mm 0.76mm 41 x 41 Spacing 1.27mm 1.0mm Spacing 1.5mm 0.6mm 30 x 30 0.6mm 33 x 33 0.76mm 33 x 33 Spacing 1.27mm 0.6mm 41x41. Package List: 27 Pcs/Set x For BGA Universal Stencils