Enhance the cooling efficiency of your electronic devices with this high-quality Heat Sink, expertly crafted from 6063-T5 extruded aluminum for excellent thermal conductivity and durability. Designed with precision stamping and molding techniques, this heat sink maximizes surface area contact with cooling air to effectively dissipate heat, reducing the risk of hardware failure due to overheating. Its lightweight construction makes it ideal for use in applications where weight is a concern, providing reliable cooling without adding unnecessary bulk. Key Features: · Premium 6063-T5 Extruded Aluminum: Ensures superior heat conduction and long-lasting performance, making it an ideal choice for thermal management. · Optimized Design for Maximum Cooling: Engineered to maximize surface area exposure to airflow, enhancing heat dissipation and maintaining device stability. · Lightweight and Durable: The aluminum construction keeps the heat sink light for easy integration into lightweight products without compromising strength. · Wide Compatibility: Perfectly suited for Raspberry Pi (1st, 2nd, and 3rd generations), set-top boxes, LED devices, players, routers, security systems, CPUs, north and south bridge chips, IC coolers, medical equipment, MOS modules, triodes, power supplies, electronic tubes, PCB power boards, video memory, electrical appliances, and various electronic components. · Versatile Application: Ideal for cooling chips, modules, and other heat-generating components in a broad range of electronic and electrical devices. Specifications: · Item Type: Heat Sink · Model: P120x64x6-GO · Size: 120 x 64 x 6 mm (4.72 x 2.52 x 0.24 inches) · Color: Golden · Material: 6063-T5 Extruded High-Quality Aluminum Package Includes: · 1 x Heat Sink This Heat Sink offers an efficient, lightweight, and durable cooling solution to protect your sensitive electronics from overheating, ensuring enhanced performance and extended device lifespan. Ideal for both professional and DIY applications, it is a reliable choice for effective thermal management.